M. Shevelov, V. Sieroshtan, O. Ruban, A. Burygin, Petro Komakha, O. Aleksieiev, O. Chayka, G. Sevskiy, Peter Stoehr, P. Heide, M. Vossiek
{"title":"小尺寸和低规格的四频段系统级封装(SiP)模块","authors":"M. Shevelov, V. Sieroshtan, O. Ruban, A. Burygin, Petro Komakha, O. Aleksieiev, O. Chayka, G. Sevskiy, Peter Stoehr, P. Heide, M. Vossiek","doi":"10.1109/MWSYM.2011.5973562","DOIUrl":null,"url":null,"abstract":"A very small form factor and low profile quad-band System-in-Package (SiP) module based on the state-of-the-art brand new 65nm CMOS IC is presented. The SiP module provides full function of 2.4G and 5G WLAN, Bluetooth, GPS, FM radio and FM transmitter. The highly integrated device incorporates single chip, RF front-end module, filters for dual band WLAN and GPS, number of SMD components and metal case which provides mechanical protection and implements EMI shielding. A laminate substrate provides the interconnection and distribution of the signals and ground to various components and acts as the carrier to support the die and allow the die IOs to be distributed to the package IOs. Very compact SiP solution with dimensions of 9.5×11.9×1.2mm3 forms a complete stand-alone multi functional wireless communication system.","PeriodicalId":294862,"journal":{"name":"2011 IEEE MTT-S International Microwave Symposium","volume":"14 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Small form factor and low profile quad-band System-in-Package (SiP) module\",\"authors\":\"M. Shevelov, V. Sieroshtan, O. Ruban, A. Burygin, Petro Komakha, O. Aleksieiev, O. Chayka, G. Sevskiy, Peter Stoehr, P. Heide, M. Vossiek\",\"doi\":\"10.1109/MWSYM.2011.5973562\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A very small form factor and low profile quad-band System-in-Package (SiP) module based on the state-of-the-art brand new 65nm CMOS IC is presented. The SiP module provides full function of 2.4G and 5G WLAN, Bluetooth, GPS, FM radio and FM transmitter. The highly integrated device incorporates single chip, RF front-end module, filters for dual band WLAN and GPS, number of SMD components and metal case which provides mechanical protection and implements EMI shielding. A laminate substrate provides the interconnection and distribution of the signals and ground to various components and acts as the carrier to support the die and allow the die IOs to be distributed to the package IOs. Very compact SiP solution with dimensions of 9.5×11.9×1.2mm3 forms a complete stand-alone multi functional wireless communication system.\",\"PeriodicalId\":294862,\"journal\":{\"name\":\"2011 IEEE MTT-S International Microwave Symposium\",\"volume\":\"14 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-06-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 IEEE MTT-S International Microwave Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MWSYM.2011.5973562\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 IEEE MTT-S International Microwave Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MWSYM.2011.5973562","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Small form factor and low profile quad-band System-in-Package (SiP) module
A very small form factor and low profile quad-band System-in-Package (SiP) module based on the state-of-the-art brand new 65nm CMOS IC is presented. The SiP module provides full function of 2.4G and 5G WLAN, Bluetooth, GPS, FM radio and FM transmitter. The highly integrated device incorporates single chip, RF front-end module, filters for dual band WLAN and GPS, number of SMD components and metal case which provides mechanical protection and implements EMI shielding. A laminate substrate provides the interconnection and distribution of the signals and ground to various components and acts as the carrier to support the die and allow the die IOs to be distributed to the package IOs. Very compact SiP solution with dimensions of 9.5×11.9×1.2mm3 forms a complete stand-alone multi functional wireless communication system.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
