你可以用事务级蜂蜜捕获更多的bug

M. Abramovici, K. Goossens, B. Vermeulen, J. Greenbaum, N. Stollon, A. Donlin
{"title":"你可以用事务级蜂蜜捕获更多的bug","authors":"M. Abramovici, K. Goossens, B. Vermeulen, J. Greenbaum, N. Stollon, A. Donlin","doi":"10.1145/1450135.1450163","DOIUrl":null,"url":null,"abstract":"In this special session we explore holistic approaches to hardware/software debug that use or integrate transaction level models (TLMs). We present several TLM-based approaches to system-level diagnostics, ranging from use of most popular transaction level modeling languages through to hybrid technologies that combine TLMs with other well known diagnostic tools like in-silicon trace logic.","PeriodicalId":300268,"journal":{"name":"International Conference on Hardware/Software Codesign and System Synthesis","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-10-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"You can catch more bugs with transaction level honey\",\"authors\":\"M. Abramovici, K. Goossens, B. Vermeulen, J. Greenbaum, N. Stollon, A. Donlin\",\"doi\":\"10.1145/1450135.1450163\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this special session we explore holistic approaches to hardware/software debug that use or integrate transaction level models (TLMs). We present several TLM-based approaches to system-level diagnostics, ranging from use of most popular transaction level modeling languages through to hybrid technologies that combine TLMs with other well known diagnostic tools like in-silicon trace logic.\",\"PeriodicalId\":300268,\"journal\":{\"name\":\"International Conference on Hardware/Software Codesign and System Synthesis\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-10-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Conference on Hardware/Software Codesign and System Synthesis\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1145/1450135.1450163\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Conference on Hardware/Software Codesign and System Synthesis","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/1450135.1450163","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7

摘要

在这个特别的会议中,我们将探讨使用或集成事务级模型(tlm)的硬件/软件调试的整体方法。我们提出了几种基于tlm的系统级诊断方法,包括使用最流行的事务级建模语言,以及将tlm与其他众所周知的诊断工具(如硅内跟踪逻辑)相结合的混合技术。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
You can catch more bugs with transaction level honey
In this special session we explore holistic approaches to hardware/software debug that use or integrate transaction level models (TLMs). We present several TLM-based approaches to system-level diagnostics, ranging from use of most popular transaction level modeling languages through to hybrid technologies that combine TLMs with other well known diagnostic tools like in-silicon trace logic.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Furion: alleviating overheads for deep learning framework on single machine (work-in-progress) A chip-level security framework for assessing sensor data integrity: work-in-progress Dynamic data management for automotive ECUs with hybrid RAM-NVM memory: work-in-progress An on-chip interconnect and protocol stack for multiple communication paradigms and programming models Efficient dynamic voltage/frequency scaling through algorithmic loop transformation
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1