磁/半导体位MRAM单元的技术评估

H. Boeve, J. Das, L. Lagae, P. Peumans, C. Bruynseraede, K. Dessein, L. Melo, R. Sousa, P. Freitas, G. Borghs, J. De Boeck
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引用次数: 1

摘要

虽然MRAM电路可以在不需要在每个位上集成半导体开关的情况下制造,但大多数应用将需要一个类似dram的平面图,并结合磁性半导体位。在评估这种集成可行性的第一种方法中,我们将自旋阀结构与半导体二极管集成在一起[1]。此外,在MEC I INESC合作(ESPRIT #28.229 I TI-MRAM)中,对隧道交叉口的集成可行性进行了评估。我们正在解决的主要问题是磁性隧道结I半导体元件阵列的制造以及MTI性能作为集成过程参数的函数。在本文中,我们介绍了我们对磁性半导体位的MRAM电路的评估结果。
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Technology assessment for MRAM cells with magnet/semiconductor bits
Although MRAM circuits can be fabricated without the need for an integrated semiconductor switch in each bit, most applications will require a DRAM-like floorplan with combined magnetlsemiconductor bits. In a first approach to assess the feasibility of such integration, we have integrated spin-valve structures with semiconductor diodes [I]. Further, in an [MEC I INESC collaboration (ESPRIT #28.229 I TI-MRAM) the integration feasibility of tunnel junctions is assessed. The main issues we are tackling are the fabrication of arrays of magnetic tunneljunction I semiconductor elements and the MTI performance as a function of the parameters of the integration pmcess. In this paper we present results of our assessment of MRAM circuits with magnetlsemiconductor bits.
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