先进的CMOS技术:Ge, SiGe, Si:C和基于Si的器件的S&D盐化

V. Carron
{"title":"先进的CMOS技术:Ge, SiGe, Si:C和基于Si的器件的S&D盐化","authors":"V. Carron","doi":"10.1109/RTP.2008.4690533","DOIUrl":null,"url":null,"abstract":"▪ Strained and Ge-based materials have great interests for CMOS technology enhancement ▪ However, their introduction as channel and/or S&D materials has a strong impact on the Salicide process which needs adaptations in order to keep the expected benefit induced by these new materials ▪ Indeed, new issues related to the silicidation (germanidation) of these advanced materials have emerged and most of them have been solved (exemple : Ge lateral diffusion) ▪ In addition to strained and Ge-based materials, the choice of the silicide/germanide contact material in itself, as well as the associated salicide process, are key areas for further performance enhancement (interface engineering, dual silicide approach…)","PeriodicalId":317927,"journal":{"name":"2008 16th IEEE International Conference on Advanced Thermal Processing of Semiconductors","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"S&D salicidation for advanced CMOS technology: Ge, SiGe, Si:C, and sSibased devices\",\"authors\":\"V. Carron\",\"doi\":\"10.1109/RTP.2008.4690533\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"▪ Strained and Ge-based materials have great interests for CMOS technology enhancement ▪ However, their introduction as channel and/or S&D materials has a strong impact on the Salicide process which needs adaptations in order to keep the expected benefit induced by these new materials ▪ Indeed, new issues related to the silicidation (germanidation) of these advanced materials have emerged and most of them have been solved (exemple : Ge lateral diffusion) ▪ In addition to strained and Ge-based materials, the choice of the silicide/germanide contact material in itself, as well as the associated salicide process, are key areas for further performance enhancement (interface engineering, dual silicide approach…)\",\"PeriodicalId\":317927,\"journal\":{\"name\":\"2008 16th IEEE International Conference on Advanced Thermal Processing of Semiconductors\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 16th IEEE International Conference on Advanced Thermal Processing of Semiconductors\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/RTP.2008.4690533\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 16th IEEE International Conference on Advanced Thermal Processing of Semiconductors","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RTP.2008.4690533","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

-应变和锗基材料对CMOS技术的增强有很大的兴趣-然而,它们作为通道和/或S&D材料的引入对Salicide工艺产生了强烈的影响,需要进行调整,以保持这些新材料所带来的预期效益-实际上,与这些先进材料的硅化(锗化)相关的新问题已经出现,其中大多数已经解决(例如:除了应变材料和锗基材料外,硅化/锗化接触材料本身的选择,以及相关的水化物工艺,是进一步提高性能的关键领域(界面工程、双硅化方法……)
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
S&D salicidation for advanced CMOS technology: Ge, SiGe, Si:C, and sSibased devices
▪ Strained and Ge-based materials have great interests for CMOS technology enhancement ▪ However, their introduction as channel and/or S&D materials has a strong impact on the Salicide process which needs adaptations in order to keep the expected benefit induced by these new materials ▪ Indeed, new issues related to the silicidation (germanidation) of these advanced materials have emerged and most of them have been solved (exemple : Ge lateral diffusion) ▪ In addition to strained and Ge-based materials, the choice of the silicide/germanide contact material in itself, as well as the associated salicide process, are key areas for further performance enhancement (interface engineering, dual silicide approach…)
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Effect of wafer thickness on sheet resistance during spike annealing Enhancing tensile stress and source/drain activation with Si:C with innovations in ion implant and millisecond laser spike annealing High precision micro-scale Hall effect characterization method using in-line micro four-point probes Laser spike annealing and its application to leading-edge logic devices Laser annealing of double implanted layers for IGBT Power Devices
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1