LC-based WiFi and WiMAX Baluns embedded in a multilayer organic flip-chip ball grid array (FCBGA) package substrate

Two lumped element baluns designed using embedded inductors and capacitors are discussed in this paper. The structures designed for WiFi and mobile WiMAX applications have very small form-factors with surface area of 3 mm2 or less making them ideal for portable wireless communication devices such as mobile internet devices and ultra-mobile personal computers. The baluns, fabricated as part of a multi-layer FCBGA package substrate, also display very good electrical performance. The measured insertion loss and phase imbalances were lower than -0.85 dB and 3 degrees respectively for some implementations.