硅浅结中杂质原子化学键态的深度分布及其与电活动的关系

K. Tsutsui, Norifumi Hoshino, Y. Nakagawa, Masaoki Tanaka, H. Nohira, K. Kakushima, P. Ahemt, Y. Sasaki, B. Mizuno, T. Hattori, H. Iwai
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摘要

用软x射线光电子能谱(SXPES)分析了Si中掺杂杂质B、as、P和Sb的化学键态。一步一步的浅层蚀刻和霍尔效应测量与SXPES相结合,研究了化学键状态与电激活之间的相关性,并阐明了浅层结中活化和失活杂质浓度的深度分布。对B掺杂层的研究表明,活化的B有一个化学键态,而失活的B有另外两个化学键态,可能形成B簇。另一方面,每种给体类型杂质(As, P和Sb)都检测到两种不同的化学键态,但这两种状态不一定与电激活和失活原子相关。
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Depth profiling of chemical bonding states of impurity atoms and their correlation with electrical activity in Si shallow junctions
Chemical bonding states of doped impurities such as B, As, P and Sb in Si were analyzed by soft X-ray photoelectron spectroscopy (SXPES). A step-by-step shallow etching and Hall effect measurements were combined with the SXPES to investigate correlation between chemical bonding state and electrical activation, and to clarify depth profiles of concentration of activated and deactivated impurities in shallow junctions. The study of B doped layer revealed that one chemical bonding state is assined to activated B and the other two states are correlated with deactivated B, which probably form B clusters. On the other hand, two different chemical bonding states were detected for each donor type impurity (As, P and Sb), however, these two states could not be necessarily correlated with the electrically activated and deactivated atoms.
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