{"title":"基板热特性的模拟","authors":"N. M. Shaalan, Ashraf H. Yahia","doi":"10.1117/12.941630","DOIUrl":null,"url":null,"abstract":"Different computational techniques were used to simulate thermal characteristics of nodal points on substrate chips. Multiple distributed thermal disturbances were investigated through thermal resistance calculations among the substrate surface. The simulated results for multiple heat sources are similar to those experimented.","PeriodicalId":127161,"journal":{"name":"Hague International Symposium","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"1987-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Simulation Of Thermal Characteristics Of Substrates\",\"authors\":\"N. M. Shaalan, Ashraf H. Yahia\",\"doi\":\"10.1117/12.941630\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Different computational techniques were used to simulate thermal characteristics of nodal points on substrate chips. Multiple distributed thermal disturbances were investigated through thermal resistance calculations among the substrate surface. The simulated results for multiple heat sources are similar to those experimented.\",\"PeriodicalId\":127161,\"journal\":{\"name\":\"Hague International Symposium\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1987-10-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Hague International Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1117/12.941630\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Hague International Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/12.941630","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Simulation Of Thermal Characteristics Of Substrates
Different computational techniques were used to simulate thermal characteristics of nodal points on substrate chips. Multiple distributed thermal disturbances were investigated through thermal resistance calculations among the substrate surface. The simulated results for multiple heat sources are similar to those experimented.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
