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引用次数: 0

摘要

本文描述了sige沟道p- mosfet的空穴限制栅电压范围(V/sub / hc/)的解析模型。模型表明,V/sub hc/取决于阈值电压、栅极氧化物与硅帽厚度比、SiGe通道顶部的Ge摩尔分数、栅极材料的功函数和衬底掺杂。随着器件的缩小和电源的减少,硅帽应该减薄到与栅极氧化物相同的量级,以实现全偏置范围的硅沟道工作。阐明了各种体积和SOI SiGe p- mosfet具有相同的空穴约束能力,阈值电压可调整到电路应用所需的值。
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An analytical model of hole confinement gate voltage range for SiGe-channel p-MOSFETs
This paper describes an analytical model of hole confinement gate voltage range (V/sub hc/) for SiGe-channel p-MOSFETs. The model shows that V/sub hc/ depends on threshold voltage, gate oxide to Si cap thickness ratio, Ge mole fraction at the top of SiGe channel, work function of gate material, and substrate doping. With device scaling and power supply reduction, the Si cap should be thinned by the same magnitude as the gate oxide to realize full bias range SiGe-channel operation. Various bulk and SOI SiGe p-MOSFETs are clarified to have the same hole confinement capability with threshold voltage adjusted to the value required by circuit application.
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