Shaofang Gong, A. Backstrom, M. Agesjo, A. Serban, M. Karlsson
{"title":"集成在PCB中的5ghz射频前端","authors":"Shaofang Gong, A. Backstrom, M. Agesjo, A. Serban, M. Karlsson","doi":"10.1109/HDP.2006.1707582","DOIUrl":null,"url":null,"abstract":"A radio frequency (RF) front-end module at 5 GHz has been designed and implemented in a conventional printed circuit board (PCB). The module consists of two switches, two bandpass filters, a balun, a low noise amplifier and a power amplifier. Distributed components and sub-circuits based upon the transmission line theory have been utilized for the module design. All the sub-circuits and the entire module have been evaluated by both simulation and measurements. It is shown that RF modules at 5 GHz can be integrated in a PCB utilizing a conventional PCB process. This module integration technique provides not only low cost but also high performance because of the elimination of parasitics associated with lumped components in a conventional design","PeriodicalId":406794,"journal":{"name":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Integration of a 5-GHz radio front-end in PCB\",\"authors\":\"Shaofang Gong, A. Backstrom, M. Agesjo, A. Serban, M. Karlsson\",\"doi\":\"10.1109/HDP.2006.1707582\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A radio frequency (RF) front-end module at 5 GHz has been designed and implemented in a conventional printed circuit board (PCB). The module consists of two switches, two bandpass filters, a balun, a low noise amplifier and a power amplifier. Distributed components and sub-circuits based upon the transmission line theory have been utilized for the module design. All the sub-circuits and the entire module have been evaluated by both simulation and measurements. It is shown that RF modules at 5 GHz can be integrated in a PCB utilizing a conventional PCB process. This module integration technique provides not only low cost but also high performance because of the elimination of parasitics associated with lumped components in a conventional design\",\"PeriodicalId\":406794,\"journal\":{\"name\":\"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-06-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/HDP.2006.1707582\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HDP.2006.1707582","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A radio frequency (RF) front-end module at 5 GHz has been designed and implemented in a conventional printed circuit board (PCB). The module consists of two switches, two bandpass filters, a balun, a low noise amplifier and a power amplifier. Distributed components and sub-circuits based upon the transmission line theory have been utilized for the module design. All the sub-circuits and the entire module have been evaluated by both simulation and measurements. It is shown that RF modules at 5 GHz can be integrated in a PCB utilizing a conventional PCB process. This module integration technique provides not only low cost but also high performance because of the elimination of parasitics associated with lumped components in a conventional design