混合信号集成电路中的衬底噪声耦合

Proceedings IEEE Southeastcon '98 'Engineering for a New Era' Pub Date : 1998-04-24 DOI:10.1109/SECON.1998.673318

M. M. Mahin, J. Yuan, A. Whittakar, M. Chian, K. Ports

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引用次数: 29

摘要

本文研究了混合信号集成电路中的衬底噪声耦合及其对模拟/数字电路的影响。提出了一种适合SPICE中高速高频工作的混合信号电路的仿真技术。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Substrate noise coupling in mixed-signal ICs

In this paper, we investigate the substrate noise coupling in the mixed-signal IC and its effect on the analog/digital circuits. A proper simulation technique for mixed-signal circuits in SPICE, operating at high speeds and high frequencies, is developed.

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Proceedings IEEE Southeastcon '98 'Engineering for a New Era'

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