面向封装天线(AiP)的宽带双极化天线设计

Wei-Lun Hsu, Yuan-Chun Lin, Kuo-Hung Cheng, Shih-Cheng Lin, Chia-Chan Chang, Sheng-Fuh Chang
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引用次数: 0

摘要

提出了一种用于封装天线(Antenna-in-Package, AiP)系统的低速宽带双极化电路。天线由一个中间贴片组成,中间贴片被人工磁导体(AMC)结构包围。与传统贴片天线相比,工作频率带宽从6%提高到20.7%。该天线的最大增益为7.8 dBi,在工作频率范围内具有出色的增益平坦性。总体大小约为$0.56 \lambda_{0}\乘以0.56\lambda_{0}\乘以0.077\lambda_{0}$。同时,对$2\ × 2$天线阵列也进行了讨论。
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A Wideband Dual-Polarized Antenna Designed for Antenna-in-Package (AiP)
The paper presents a low-profile wideband dual-polarized for Antenna-in-Package (AiP) system. The antenna consists of a middle patch surrounded by artificial magnetic conductor (AMC) structure. Compared to the conventional patch antenna, the operating frequency bandwidth is increased from 6% to 20.7%. The antenna has a maximum gain of 7.8 dBi with excellent gain flatness over the operating frequency range. The overall size is about $0.56 \lambda_{0} \times 0.56\lambda_{0}\times 0.077\lambda_{0}$. Meanwhile, the $2\times 2$ antenna array has also been discussed.
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