高性能底填料开发-材料，工艺和可靠性

Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268) Pub Date : 1997-10-26 DOI:10.1109/PEP.1997.656503

L. Nguyen, L. Hoang, P. Fine, S. Shi, M. Vincent, L. Wang, C. Wong, Q. Tong, B. Ma, R. Humphreys, A. Savoca

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引用次数: 35

摘要

典型的下填料可将倒装芯片结构的焊料寿命提高一个数量级。随着越来越多的封装应用需要倒装芯片互连，许多行业的兴趣一直致力于开发更好的下填材料，这种材料比目前的商业材料更具成本效益，提供更好的性能。本文介绍了最近darpa资助的一项计划的亮点，该计划旨在开发用于低成本倒装芯片应用的新型下填材料。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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High performance underfills development - materials, processes, and reliability

The typical underfill enhances the solder life of flip chip structures by up to an order of magnitude. With increasing packaging applications requiring flip chip interconnection, much industry interest has been devoted to the development of better underfill materials, which are more cost-effective and provide better performance than current commercial materials. This paper presents the highlights of a recent DARPA-funded program to develop new underfill materials for low-cost flip chip applications.

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Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268)

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