G. Jablonski, P. Janus, P. Pietrzak, T. Torzewicz, A. Sobczak, M. Janicki, A. Napieralski, A. Sierakowski, A. Brzezińska, P. Prokaryn
{"title":"MEMS测试纳米结构的制造与表征","authors":"G. Jablonski, P. Janus, P. Pietrzak, T. Torzewicz, A. Sobczak, M. Janicki, A. Napieralski, A. Sierakowski, A. Brzezińska, P. Prokaryn","doi":"10.1109/THERMINIC.2017.8233794","DOIUrl":null,"url":null,"abstract":"Heat transfer phenomena in electronic nanostructures are supposed not to obey the classic Fourier heat transfer theory. Thus, in order to verify this hypothesis experimentally, a set of MEMS nanostructures was designed and manufactured. These structures contain a number of cavities filled with different materials, including various dielectrics, such as silicon dioxide and the silicon nitride, or air as well as thin film platinum resistors located over and under the cavities. These resistors might serve either as heat sources or temperature sensors. This paper presents in detail the fabrication process of these devices and the preliminary results of their characterisation.","PeriodicalId":317847,"journal":{"name":"2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Manufacturing and characterisation of MEMS test nanostructures\",\"authors\":\"G. Jablonski, P. Janus, P. Pietrzak, T. Torzewicz, A. Sobczak, M. Janicki, A. Napieralski, A. Sierakowski, A. Brzezińska, P. Prokaryn\",\"doi\":\"10.1109/THERMINIC.2017.8233794\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Heat transfer phenomena in electronic nanostructures are supposed not to obey the classic Fourier heat transfer theory. Thus, in order to verify this hypothesis experimentally, a set of MEMS nanostructures was designed and manufactured. These structures contain a number of cavities filled with different materials, including various dielectrics, such as silicon dioxide and the silicon nitride, or air as well as thin film platinum resistors located over and under the cavities. These resistors might serve either as heat sources or temperature sensors. This paper presents in detail the fabrication process of these devices and the preliminary results of their characterisation.\",\"PeriodicalId\":317847,\"journal\":{\"name\":\"2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)\",\"volume\":\"8 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/THERMINIC.2017.8233794\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/THERMINIC.2017.8233794","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Manufacturing and characterisation of MEMS test nanostructures
Heat transfer phenomena in electronic nanostructures are supposed not to obey the classic Fourier heat transfer theory. Thus, in order to verify this hypothesis experimentally, a set of MEMS nanostructures was designed and manufactured. These structures contain a number of cavities filled with different materials, including various dielectrics, such as silicon dioxide and the silicon nitride, or air as well as thin film platinum resistors located over and under the cavities. These resistors might serve either as heat sources or temperature sensors. This paper presents in detail the fabrication process of these devices and the preliminary results of their characterisation.