嵌入式教程:恢复硬件安全性和信任

O. Sinanoglu
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引用次数: 0

摘要

今天的片上系统(SoC)正在与数字、模拟、射频、光子和其他器件相结合[1]。最近,传感器、执行器和生物芯片也被集成到这些已经很强大的soc中。一方面,混合系统集成的进步和晶圆尺寸的增加(目前约为300毫米,预计到2018年将达到450毫米[1])使SoC集成成为可能。因此,这种soc的每片成本降低了。另一方面,对多种功能和混合技术的支持增加了先进铸造厂的拥有成本。例如,2015年拥有一家晶圆代工厂的成本将达到50亿美元[2]。因此,现在只有大型商业代工厂生产这种高性能,混合系统soc,特别是在先进的技术节点[3]。
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Embedded tutorial: Regaining hardware security and trust
Today's System on Chip (SoC) is being incorporated with digital, analog, radio frequency, photonic and other devices [1]. More recently, sensors, actuators, and biochips are also being integrated into these already powerful SoCs. On one hand, SoC integration has been enabled by advances in mixed system integration and the increase in the wafer sizes (currently about 300 mm and projected to be 450mm by 2018 [1]). Consequently, the cost per chip of such SOCs has reduced. On the other hand, support for multiple capabilities and mixed technologies has increased the cost of ownership of advanced foundries. For instance, the cost of owning a foundry will be $5 billion in 2015 [2]. Consequently, only large commercial foundries now manufacture such high performance, mixed system SoCs especially at the advanced technology nodes [3].
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