在无线应用的商用高性能微处理器中实现最佳性能/可靠性/功率权衡的工业实践进展

2013 IEEE International Reliability Physics Symposium (IRPS) Pub Date : 2013-04-14 DOI:10.1109/IRPS.2013.6531998

V. Huard, F. Cacho, L. Claramond, P. Alves, W. Dalkowski, D. Jacquet, S. Lecomte, M. Tan, B. Delemer, A. Kamoun, V. Fraisse

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引用次数: 4

摘要

本文讨论了在先进CMOS节点的无线应用中优化商用高性能微处理器的性能/可靠性/功耗权衡的挑战。电气可靠性下降的影响和热失控风险的增加都需要一种结合产品工程和高级建模方法的专用方法，即使在众多离散的V-F操作模式及其相关任务剖面的情况下，也能实现最佳可靠性保护带的确定。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Advances in industrial practices for optimal performance/reliability/power trade-off in commercial high-performance microprocessors for wireless applications

This paper deals with the challenge of optimizing the performance/reliability/power trade-off in commercial high-performance microprocessors for wireless applications in advanced CMOS nodes. Both the increased impact of electrical reliability degradation and an increased thermal runaway risk require a dedicated approach combining product engineering and high-level modeling approach to achieve optimal reliability guardband determination even in the case of numerous, discrete V-F operating modes and their related mission profiles.

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2013 IEEE International Reliability Physics Symposium (IRPS)

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