用正电子湮灭研究了等离子体掺杂制备的超浅结中的空位型缺陷

A. Uedono, K. Tsutsui, S. Ishibashi, Hiromichi Watanabe, S. Kubota, K. Tenjinbayashi, Y. Nakagawa, B. Mizuno, T. Hattori, H. Iwai
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引用次数: 2

摘要

用单能正电子束探测等离子体浸没b注入硅中的空位型缺陷。一个正电子与一个电子湮灭并释放出两个511kev γ-量子。测量了湮灭辐射的多普勒展宽光谱,并与用第一性原理计算得到的光谱进行了比较。对于掺杂样品,发现富空位区位于距离表面0-10 nm范围内,并且确定主要缺陷种为空位- b配合物。经过1075℃的尖峰快速退火后,这些配合物被退火出来,变成分布在距离表面4 ~ 32 nm之间的B团簇,如二十面体B12。我们将证明,正电子湮灭技术对硅衬底上形成的浅结中的点缺陷很敏感,而不受位于取代位的B原子的影响。
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Vacancy-type defects in ultra-shallow junctions fabricated using plasma doping studied by positron annihilation
Vacancy-type defects in plasma immersion B-implanted Si were probed by a monoenergetic positron beam. A positron annihilates with an electron and emits two 511 keV γ-quanta. Doppler broadening spectra of the annihilation radiation were measured and compared with spectra calculated using the first-principles calculations. For the as-doped sample, the vacancy-rich region was found to be localized within 0–10 nm from the surface, and the major defect species were determined to be divacancy-B complexes. After spike rapid thermal annealing at 1075°C, those complexes were annealed out, and turned to B clusters such as icosahedral B12 distributed between 4 nm and 32 nm from the surface. We will demonstrate that that the positron annihilation technique is sensitive to point defects in shallow junctions formed on Si substrates without influence of B atoms located in the substitutional site.
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