{"title":"光通信系统的光子封装。基础和应用","authors":"Ulrich Fischer-Hirchert","doi":"10.1109/STYSW.2005.1617791","DOIUrl":null,"url":null,"abstract":"In this report, different fiber-chip coupling concepts are presented. Automated coupling process, as well as different modules for laser welding, gluing and mechanical fixation are also discussed. Thermal stress tests are reported","PeriodicalId":351138,"journal":{"name":"Proceedings of 2005 International Students and Young Scientists Workshop Photonics and Microsystems, 2005.","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-07-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Photonic packaging for optical communications systems-basics and applications\",\"authors\":\"Ulrich Fischer-Hirchert\",\"doi\":\"10.1109/STYSW.2005.1617791\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this report, different fiber-chip coupling concepts are presented. Automated coupling process, as well as different modules for laser welding, gluing and mechanical fixation are also discussed. Thermal stress tests are reported\",\"PeriodicalId\":351138,\"journal\":{\"name\":\"Proceedings of 2005 International Students and Young Scientists Workshop Photonics and Microsystems, 2005.\",\"volume\":\"16 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-07-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of 2005 International Students and Young Scientists Workshop Photonics and Microsystems, 2005.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/STYSW.2005.1617791\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 2005 International Students and Young Scientists Workshop Photonics and Microsystems, 2005.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STYSW.2005.1617791","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Photonic packaging for optical communications systems-basics and applications
In this report, different fiber-chip coupling concepts are presented. Automated coupling process, as well as different modules for laser welding, gluing and mechanical fixation are also discussed. Thermal stress tests are reported
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