A comparison of higher-order graded-index MMI-based splitters in thin glass sheets for PCB integration

Integrated optical interconnect systems are getting higher attention due to continuously increasing data rates in computer systems. For the realization of these systems, optical waveguide components are needed. One possible approach to manufacturing graded-index waveguide components is their embedding in thin glass sheets by thermal diffusion processes. In this work, two approaches for the realization of higher order optical MMI-based splitters are compared with respect to excess and insertion loss, total geometric dimensions and the resulting constraints for the manufacturing process.