{"title":"多芯片模块的金属绝缘体结构","authors":"P. Kohl","doi":"10.1109/ELECTR.1991.718215","DOIUrl":null,"url":null,"abstract":"The technology and material choices available for MCMs are discussed in terms of a cost-yield model. The basic building blocks of MCMs are presented and viewed in terms of the number of processing steps, defect density and processing costs.","PeriodicalId":339281,"journal":{"name":"Electro International, 1991","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1991-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Metal Insulator Structures For Multichip Modules\",\"authors\":\"P. Kohl\",\"doi\":\"10.1109/ELECTR.1991.718215\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The technology and material choices available for MCMs are discussed in terms of a cost-yield model. The basic building blocks of MCMs are presented and viewed in terms of the number of processing steps, defect density and processing costs.\",\"PeriodicalId\":339281,\"journal\":{\"name\":\"Electro International, 1991\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1991-04-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electro International, 1991\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ELECTR.1991.718215\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electro International, 1991","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ELECTR.1991.718215","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The technology and material choices available for MCMs are discussed in terms of a cost-yield model. The basic building blocks of MCMs are presented and viewed in terms of the number of processing steps, defect density and processing costs.
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