{"title":"用于降低电磁干扰的宽带隙功率半导体器件封装技术综述","authors":"Boyi Zhang, Shuo Wang","doi":"10.1109/EMCSI.2018.8495171","DOIUrl":null,"url":null,"abstract":"Wide band gap (WBG) power semiconductor devices have been increasingly desirable due to their superior characteristics compared to their Si counterparts. However, their faster switching speed and abilities to operate at higher frequency than Si devices have brought new challenges, among which Electromagnetic interference (EMI) issue is one of the major concerns. EMI issues in WBG device applications had been reported in many papers. However, package layout determined characteristics has not yet been connected to electromagnetic compliance (EMC) analysis. In this paper, characteristics of WBG power devices as EMI noise sources are investigated, package design considerations that could reduce EMI are reviewed.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"16","resultStr":"{\"title\":\"An Overview of Wide Bandgap Power Semiconductor Device Packaging Techniques for EMI Reduction\",\"authors\":\"Boyi Zhang, Shuo Wang\",\"doi\":\"10.1109/EMCSI.2018.8495171\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Wide band gap (WBG) power semiconductor devices have been increasingly desirable due to their superior characteristics compared to their Si counterparts. However, their faster switching speed and abilities to operate at higher frequency than Si devices have brought new challenges, among which Electromagnetic interference (EMI) issue is one of the major concerns. EMI issues in WBG device applications had been reported in many papers. However, package layout determined characteristics has not yet been connected to electromagnetic compliance (EMC) analysis. In this paper, characteristics of WBG power devices as EMI noise sources are investigated, package design considerations that could reduce EMI are reviewed.\",\"PeriodicalId\":120342,\"journal\":{\"name\":\"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"16\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EMCSI.2018.8495171\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EMCSI.2018.8495171","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
An Overview of Wide Bandgap Power Semiconductor Device Packaging Techniques for EMI Reduction
Wide band gap (WBG) power semiconductor devices have been increasingly desirable due to their superior characteristics compared to their Si counterparts. However, their faster switching speed and abilities to operate at higher frequency than Si devices have brought new challenges, among which Electromagnetic interference (EMI) issue is one of the major concerns. EMI issues in WBG device applications had been reported in many papers. However, package layout determined characteristics has not yet been connected to electromagnetic compliance (EMC) analysis. In this paper, characteristics of WBG power devices as EMI noise sources are investigated, package design considerations that could reduce EMI are reviewed.
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