硅晶圆片缺陷的扫描表面光电压检测

J. Philbrick, T. Distefano
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引用次数: 3

摘要

扫描表面光电压(SSP)方法能够检测硅表面的各种缺陷。该方法可用于扫描大面积的硅表面,硅表面通过表面通道耦合到一个小的远程电极。本文从理论上解释了从优化光学系统获得的微分光电压信号和小光束(直径0.8 m)的情况下获得的分辨率约为2¿m。各种缺陷的SSP图像,包括自然发生的和诱发的,与其他方法产生的图像进行比较。
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Scanned Surface Photovoltage Detection of Defects in Silicon Wafers
A scanned surface photovoltage (SSP) method is capable of detecting a wide variety of defects in a silicon surface. This method can be used to scan a large area of the silicon surface, which is coupled by a surface channel to a small remote electrode. The resolution obtained, about 2 ¿m, is explained theoretically in this paper for the case of a differentiated photovoltage signal and a small (0.8 ¿m diameter) light beam from an optimized optical system. SSP images of a variety of defects, both naturally occurring and induced, were obtained along with images produced by other methods for comparison.
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