用时域反射法测量薄膜微带线的介电厚度变化

Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium Pub Date : 1993-10-04 DOI:10.1109/IEMT.1993.398229

F. Chao

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摘要

利用时域反射法测量的阻抗分布来估计薄膜微带线中介电层的厚度变化。根据近似公式推导了介质厚度与阻抗变化之间的关系。通过实测，提出了一种最大线性拟合算法来修正时域反射计(TDR)数据中的串联电阻效应

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Evaluate the dielectric thickness variation of thin-film microstrip line by time domain reflectometry

The impedance distribution measured by time domain reflectometry is utilized in estimating the thickness variation of the dielectric layer in a thin-film microstrip line. The relationship between dielectric thickness and impedance variation is derived based on an approximate formula. Measurements are carried out and a maximum linear fitting algorithm is proposed to correct the series resistance effect in the time domain reflectometer (TDR) data.<>

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Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium

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