一种新型锥形高温超导微带带阻EBG结构

2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) Pub Date : 2017-12-01 DOI:10.1109/EDAPS.2017.8276973

Yan Li, Xiaochun Li, J. Mao

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引用次数: 3

摘要

本文提出了一种新型的一维高温超导体(HTS)微带带阻电磁带隙(EBG)结构。采用锥形技术降低通带中的纹波电平。全波仿真结果表明，与铜结构相比，HTS结构具有更小的通带衰减和更大的阻带抑制，显示了其在HTS微波应用中的良好前景。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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A novel tapered HTS microstrip bandstop EBG structure

In this paper, a novel 1-D high-temperature superconductor (HTS) microstrip bandstop electromagnetic band-gap (EBG) structure is proposed. Tapering technology is used to reduce the ripple level in the passband. Full-wave simulation results show the HTS structure has much slighter attenuation in passband and larger suppression in stopband than the copper one, which shows its good prospect in HTS microwave applications.

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2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)

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