{"title":"成本驱动平台上SoC的可扩展电源交付设计方法","authors":"K. Cai, S. Ji","doi":"10.1109/SAPIW.2015.7237389","DOIUrl":null,"url":null,"abstract":"A scalable power delivery analysis methodology is described for SoCs targeted at cost-driven platforms. The methodology is applied at different design stages to consolidate a hundred independent power supplies at bump level to half that at solder ball level and to five major power supplies at board level.","PeriodicalId":231437,"journal":{"name":"2015 IEEE 19th Workshop on Signal and Power Integrity (SPI)","volume":"27 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Scalable power delivery design methodology for SoC on cost driven platforms\",\"authors\":\"K. Cai, S. Ji\",\"doi\":\"10.1109/SAPIW.2015.7237389\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A scalable power delivery analysis methodology is described for SoCs targeted at cost-driven platforms. The methodology is applied at different design stages to consolidate a hundred independent power supplies at bump level to half that at solder ball level and to five major power supplies at board level.\",\"PeriodicalId\":231437,\"journal\":{\"name\":\"2015 IEEE 19th Workshop on Signal and Power Integrity (SPI)\",\"volume\":\"27 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-05-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 IEEE 19th Workshop on Signal and Power Integrity (SPI)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SAPIW.2015.7237389\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE 19th Workshop on Signal and Power Integrity (SPI)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SAPIW.2015.7237389","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Scalable power delivery design methodology for SoC on cost driven platforms
A scalable power delivery analysis methodology is described for SoCs targeted at cost-driven platforms. The methodology is applied at different design stages to consolidate a hundred independent power supplies at bump level to half that at solder ball level and to five major power supplies at board level.