单次飞秒激光烧蚀铜:实验与模拟

SPIE Laser Damage Pub Date : 2015-11-23 DOI:10.1117/12.2195787

E. Chowdhury, K. Kafka, Robert A. Mitchell, A. Russell, Kevin Werner, N. Talisa, Hui Li, A. Yi, D. Schumacher

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引用次数: 2

摘要

将Ti:Sapphire激光发射的5飞秒和40飞秒近红外脉冲以15和45度的入射角聚焦到具有2.0 μm焦斑的单晶Cu样品表面。利用干涉深度测深仪(Wyko NT9100)对相互作用后的表面轮廓进行了研究，并与2D粒子-细胞(PIC)激光损伤模拟模型预测的陨石坑尺寸和形态进行了基准测试。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Single-shot femtosecond laser ablation of copper: experiment vs. simulation

Single 5 and 40 femtosecond, near IR pulses with fluences varying from 0.4 – 80 J/cm2 from a Ti:Sapphire laser was focused onto a single crystal Cu sample surface with 2.0 μm focal spot at 15 and 45 degree angle of incidence. The surface profiles after interaction were studied with an interferometric depth profiler (Wyko NT9100), and benchmarked against crater size and morphology predicted by 2D Particle-In-Cell (PIC) laser damage simulation model.

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SPIE Laser Damage

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