在Si上外延生长Fe-InP埋置的1.3 μm双异质结构激光器

T. Yamada, M. Tachikawa, T. Sasaki, H. Mori, Y. Kadota, S. Matsumoto, K. Kishi
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引用次数: 0

摘要

光电集成电路(OEICs),特别是硅上的光子器件,由于其将光子功能与高度集成的硅电子电路相结合的潜力而具有吸引力。我们已经证明了1.5 μm多量子阱激光器的长期连续波工作和1.3 μm双异质结构(DH)激光器的高温连续波工作。低阈值电流激光器需要降低oeic的功耗。用半绝缘InP埋入激光是降低阈值电流的有效方法。半绝缘埋地结构对于降低高频工作的寄生电容也是必不可少的。虽然半绝缘的InP层已经成功地生长在硅衬底上,但还没有将其应用于硅基器件的报道。
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An Fe-InP buried 1.3-μm double heterostructure laser heteroepitaxially grown on Si
Opto-electronic integrated circuits (OEICs), especially photonic devices on Si, are attractive because of their potential to combine photonic functions with highly integrated silicon electronic circuits. We have already demonstrated long term cw operation of a 1.5-μm multiple quantum well laser1) and high-temperature cw operation of a 1.3-μm double heterostructure (DH) laser2) heteroepitaxially grown on Si. Low threshold current lasers are required to reduce the power consumption of OEICs. An effective approach to reduce the threshold current is burying lasers with semi-insulating InP. The semi-insulating buried structure is also indispensable to reduce parasitic capacitance for high-frequency operation. Though a semi-insulating InP layer has been successfully grown on a Si substrate,3) there are no reports on its application to devices on Si.
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