嵌入式处理器的目标独立热建模

Cándido Méndez, J. Ayala, M. López-Vallejo
{"title":"嵌入式处理器的目标独立热建模","authors":"Cándido Méndez, J. Ayala, M. López-Vallejo","doi":"10.1109/IES.2006.357459","DOIUrl":null,"url":null,"abstract":"This paper presents a complete modeling approach to analyze the thermal behavior of microprocessor-based systems. While most compact modeling approaches require a deep knowledge of the implementation details, our method defines a black box technique which can be applied to different target processors when this detailed information is unknown. The obtained results show high accuracy, applicability and can be easily automated. The proposed methodology has been used to study the impact of code transformations in the thermal behavior of the chip. Finally, the analysis of the thermal effect of the source code modifications can be included in a temperature-aware compiler which minimizes the total temperature of the chip, as well as the temperature gradients, according to these guidelines.","PeriodicalId":412676,"journal":{"name":"2006 International Symposium on Industrial Embedded Systems","volume":"77 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Target Independent Thermal Modeling for Embedded Processors\",\"authors\":\"Cándido Méndez, J. Ayala, M. López-Vallejo\",\"doi\":\"10.1109/IES.2006.357459\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a complete modeling approach to analyze the thermal behavior of microprocessor-based systems. While most compact modeling approaches require a deep knowledge of the implementation details, our method defines a black box technique which can be applied to different target processors when this detailed information is unknown. The obtained results show high accuracy, applicability and can be easily automated. The proposed methodology has been used to study the impact of code transformations in the thermal behavior of the chip. Finally, the analysis of the thermal effect of the source code modifications can be included in a temperature-aware compiler which minimizes the total temperature of the chip, as well as the temperature gradients, according to these guidelines.\",\"PeriodicalId\":412676,\"journal\":{\"name\":\"2006 International Symposium on Industrial Embedded Systems\",\"volume\":\"77 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2006 International Symposium on Industrial Embedded Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IES.2006.357459\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2006 International Symposium on Industrial Embedded Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IES.2006.357459","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

摘要

本文提出了一种完整的建模方法来分析基于微处理器的系统的热行为。虽然大多数紧凑的建模方法需要对实现细节有深入的了解,但我们的方法定义了一种黑盒技术,当这些细节信息未知时,可以将其应用于不同的目标处理器。所得结果精度高,适用性强,易于自动化。所提出的方法已被用于研究代码转换对芯片热行为的影响。最后,对源代码修改的热效应分析可以包含在一个温度感知编译器中,该编译器可以根据这些指南最小化芯片的总温度以及温度梯度。
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Target Independent Thermal Modeling for Embedded Processors
This paper presents a complete modeling approach to analyze the thermal behavior of microprocessor-based systems. While most compact modeling approaches require a deep knowledge of the implementation details, our method defines a black box technique which can be applied to different target processors when this detailed information is unknown. The obtained results show high accuracy, applicability and can be easily automated. The proposed methodology has been used to study the impact of code transformations in the thermal behavior of the chip. Finally, the analysis of the thermal effect of the source code modifications can be included in a temperature-aware compiler which minimizes the total temperature of the chip, as well as the temperature gradients, according to these guidelines.
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