采用亚半微米WSi/Au t形栅极的k波段高增益高可靠性GaAs功率场效应管

Y. Kohno, T. Kunii, T. Oku, R. Hattori, J. Udomoto, M. Komaru, K. Yajima, A. Inoue, K. Itoh, H. Takano, O. Ishihara, S. Mitsui
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引用次数: 9

摘要

我们开发了一种具有0.35 /spl mu/m WSi/Au t型栅极结构的k波段GaAs功率MESFET。这种结构是通过在凹槽两侧形成SiO/sub - 2/侧壁来实现的,因此栅极长度很容易减小到半微米以下。当侧壁宽度大于0.25 /spl mu/m时,栅极-漏极击穿电压(Vgdo)大于15 V,该击穿电压在很大程度上取决于栅极边缘与凹槽边缘之间的距离。900 /spl mu/m门宽场效应管在1 dB增益压缩点的输出功率为27.2 dBm,在18 GHz时线性增益为9.5 dB。WSi/Au栅极场效应管在温度为125/spl度/C时的平均失效时间(MTTF)超过3E7小时。
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K-band high gain and high reliability GaAs power FET with sub-half micron WSi/Au T-shaped gate
We have developed a K-band GaAs power MESFET with 0.35 /spl mu/m WSi/Au T-shaped gate structure. This structure has been realized by forming a SiO/sub 2/ sidewall at both sides of recess, so the gate length is easily reduced to sub-half micron. A gate-to-drain breakdown voltage (Vgdo) of over 15 V, which depends strongly on the distance between gate edge and recess edge, is achieved when the sidewall width is adjusted to be more than 0.25 /spl mu/m. The 900 /spl mu/m gate-width FET has delivered an output power at 1 dB gain-compression point of 27.2 dBm with a linear gain of 9.5 dB at 18 GHz. An excellent mean time to failure (MTTF) of over 3E7 hours at Tch=125/spl deg/C has been obtained for the WSi/Au gate FET.
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