三维网格网络在芯片架构上的精确性能分析

Bheemappa Halavar, B. Talawar
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引用次数: 2

摘要

随着cmp和soc中核心和组件的数量和复杂性的增加,需要一个高度结构化和高效的片上通信网络来实现高性能和可扩展性。片上网络(NoC)作为可靠的通信框架出现在cmp和soc中。为了实现高效的片上通信,已经提出了许多二维NoC架构。在本文中,我们利用平面图驱动的导线长度和链路延迟估计来探索3D noc的设计空间。我们通过注入两种不同缓冲空间的合成交通模式来分析二维和两种三维网格拓扑的性能和成本,并在实验中考虑了基于平面图的延迟。实验结果表明,在注入速率从0.02到0.2的情况下,4层3D网格的平均网络延迟比2D网格减少了54%。4层3D Mesh的片上通信性能分别比具有均匀流量模式和转置流量模式的2D Mesh提高了2.2倍和3.1倍。
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Accurate Performance Analysis of 3D Mesh Network on Chip Architectures
With the increase in number and complexity of cores and components in CMPs and SoCs, a highly structured and efficient on-chip communication network is required to achieve high-performance and scalability. Network on Chips(NoC) emerged as the reliable communication framework in CMPs and SoCs. Many 2-D NoC architectures have been proposed for efficient on-chip communication. In this paper, we explore the design space of 3D NoCs using floorplan driven wire lengths and link delay estimation. We analyse the performance and cost of 2D and two 3D variants of the Mesh topology by injecting two synthetic traffic pattern for varying buffer space and floorplan based delays were considered to for the experiments. Results of our experiments show that for the injection rates from 0.02 to 0.2 the average network latency of a 4layer 3D Mesh is reduced up to 54% compared to its 2D counterpart. The on chip communication performance improved up to 2.2× and 3.1× in 4-layer 3D Mesh compare to 2D Mesh with uniform and transpose traffic patterns respectively.
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