一种用于原位评估微结构拉伸断裂强度的热驱动测试平台

2017 International Conference on Electron Devices and Solid-State Circuits (EDSSC) Pub Date : 2017-10-01 DOI:10.1109/EDSSC.2017.8126470

Z. Fan, Taotao Guan, Leijian Cheng, Fang Yang, Dacheng Zhang

{"title":"一种用于原位评估微结构拉伸断裂强度的热驱动测试平台","authors":"Z. Fan, Taotao Guan, Leijian Cheng, Fang Yang, Dacheng Zhang","doi":"10.1109/EDSSC.2017.8126470","DOIUrl":null,"url":null,"abstract":"This paper presents a in situ on-chip micro tensile fracture strength tester, which is based on a thermal actuated test platform. In this test platform, tensile fracture strength could be extracted and process could be evaluated, there are two samples with same layout but fabricated under different process conditions were evaluated through this test platform and the results showed that this test platform has an outstanding ability to evaluate the tensile fracture strength and thus monitor the process quality.","PeriodicalId":163598,"journal":{"name":"2017 International Conference on Electron Devices and Solid-State Circuits (EDSSC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A thermal actuated test platform for in situ evaluating the tensile fracture strength of micro-structures\",\"authors\":\"Z. Fan, Taotao Guan, Leijian Cheng, Fang Yang, Dacheng Zhang\",\"doi\":\"10.1109/EDSSC.2017.8126470\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a in situ on-chip micro tensile fracture strength tester, which is based on a thermal actuated test platform. In this test platform, tensile fracture strength could be extracted and process could be evaluated, there are two samples with same layout but fabricated under different process conditions were evaluated through this test platform and the results showed that this test platform has an outstanding ability to evaluate the tensile fracture strength and thus monitor the process quality.\",\"PeriodicalId\":163598,\"journal\":{\"name\":\"2017 International Conference on Electron Devices and Solid-State Circuits (EDSSC)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 International Conference on Electron Devices and Solid-State Circuits (EDSSC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDSSC.2017.8126470\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 International Conference on Electron Devices and Solid-State Circuits (EDSSC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDSSC.2017.8126470","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

本文介绍了一种基于热驱动测试平台的原位片上微拉伸断裂强度测试仪。在该测试平台上，可以提取拉伸断裂强度并对工艺进行评价，通过该测试平台对两种相同布局但在不同工艺条件下制作的样品进行了评价，结果表明该测试平台具有出色的拉伸断裂强度评价能力，从而监控工艺质量。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文

微信好友朋友圈 QQ好友复制链接

本刊更多论文

A thermal actuated test platform for in situ evaluating the tensile fracture strength of micro-structures

This paper presents a in situ on-chip micro tensile fracture strength tester, which is based on a thermal actuated test platform. In this test platform, tensile fracture strength could be extracted and process could be evaluated, there are two samples with same layout but fabricated under different process conditions were evaluated through this test platform and the results showed that this test platform has an outstanding ability to evaluate the tensile fracture strength and thus monitor the process quality.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2017 International Conference on Electron Devices and Solid-State Circuits (EDSSC)

自引率

0.00%

发文量