软性有机薄膜的厚度测量

D. Mladenova, V. Siderov, I. Zhivkov, O. Salyk, M. Ohlídal, I. Yordanova, R. Yordanov, P. Philippov, M. Weiter
{"title":"软性有机薄膜的厚度测量","authors":"D. Mladenova, V. Siderov, I. Zhivkov, O. Salyk, M. Ohlídal, I. Yordanova, R. Yordanov, P. Philippov, M. Weiter","doi":"10.1109/ISSE.2012.6273163","DOIUrl":null,"url":null,"abstract":"This paper compares chromatic white light (CWL) and interference microscope measurements aiming to find a proper non-contact method for a thickness determination of thin soft organic films. Standard samples with vacuum deposited aluminum films of different thicknesses in the range of 50-1000 nm were prepared and measured by both methods. It was found that the CWL technique is proper for a measurement of thin soft organic films with higher than 40-50 nm film thicknesses. As a complementary feature of the method 2D and 3D surface morphology imaging of the films could be recorded and the surface film roughness could be calculated. In a case of optical inhomogeneity the method requires covering with a uniform high reflective coating. The interference microscopy method results in a relatively lower film thickness with a higher standard deviation and a higher standard relative error. It could be connected with the resolution of the interferograms measured.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"21 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Thickness measurement of thin soft organic films\",\"authors\":\"D. Mladenova, V. Siderov, I. Zhivkov, O. Salyk, M. Ohlídal, I. Yordanova, R. Yordanov, P. Philippov, M. Weiter\",\"doi\":\"10.1109/ISSE.2012.6273163\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper compares chromatic white light (CWL) and interference microscope measurements aiming to find a proper non-contact method for a thickness determination of thin soft organic films. Standard samples with vacuum deposited aluminum films of different thicknesses in the range of 50-1000 nm were prepared and measured by both methods. It was found that the CWL technique is proper for a measurement of thin soft organic films with higher than 40-50 nm film thicknesses. As a complementary feature of the method 2D and 3D surface morphology imaging of the films could be recorded and the surface film roughness could be calculated. In a case of optical inhomogeneity the method requires covering with a uniform high reflective coating. The interference microscopy method results in a relatively lower film thickness with a higher standard deviation and a higher standard relative error. It could be connected with the resolution of the interferograms measured.\",\"PeriodicalId\":277579,\"journal\":{\"name\":\"2012 35th International Spring Seminar on Electronics Technology\",\"volume\":\"21 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-05-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 35th International Spring Seminar on Electronics Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSE.2012.6273163\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 35th International Spring Seminar on Electronics Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSE.2012.6273163","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

本文比较了彩色白光(CWL)和干涉显微镜的测量方法,旨在寻找一种适合于软质有机薄膜厚度测定的非接触方法。用这两种方法制备了50 ~ 1000 nm范围内不同厚度的真空沉积铝膜标准样品并进行了测量。结果表明,CWL技术适用于薄膜厚度大于40 ~ 50nm的软质有机薄膜的测量。该方法的一个补充特点是可以记录薄膜的二维和三维表面形貌成像,并可以计算表面薄膜的粗糙度。在光学不均匀的情况下,该方法需要覆盖均匀的高反射涂层。干涉显微法可获得相对较低的膜厚,但具有较高的标准偏差和较高的标准相对误差。这可能与所测干涉图的分辨率有关。
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Thickness measurement of thin soft organic films
This paper compares chromatic white light (CWL) and interference microscope measurements aiming to find a proper non-contact method for a thickness determination of thin soft organic films. Standard samples with vacuum deposited aluminum films of different thicknesses in the range of 50-1000 nm were prepared and measured by both methods. It was found that the CWL technique is proper for a measurement of thin soft organic films with higher than 40-50 nm film thicknesses. As a complementary feature of the method 2D and 3D surface morphology imaging of the films could be recorded and the surface film roughness could be calculated. In a case of optical inhomogeneity the method requires covering with a uniform high reflective coating. The interference microscopy method results in a relatively lower film thickness with a higher standard deviation and a higher standard relative error. It could be connected with the resolution of the interferograms measured.
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