{"title":"军用和航空电子AMLCD显示驱动互连技术","authors":"R. Reynolds","doi":"10.1109/DASC.1996.559166","DOIUrl":null,"url":null,"abstract":"The two most important display driver interconnect technology candidates for military and avionic AMLCD are tape automated bonding (TAB), and flip chip on glass (FCOG). These two technologies will be reviewed and compared in detail. The topics presented include: maturity of the respective technologies; infrastructure differences; known good die issues; FCOG layout issues; processing and run rate issues; reliability considerations; and FCOG rework issues.","PeriodicalId":332554,"journal":{"name":"15th DASC. AIAA/IEEE Digital Avionics Systems Conference","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"1996-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Display driver interconnect technology for military and avionic AMLCD\",\"authors\":\"R. Reynolds\",\"doi\":\"10.1109/DASC.1996.559166\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The two most important display driver interconnect technology candidates for military and avionic AMLCD are tape automated bonding (TAB), and flip chip on glass (FCOG). These two technologies will be reviewed and compared in detail. The topics presented include: maturity of the respective technologies; infrastructure differences; known good die issues; FCOG layout issues; processing and run rate issues; reliability considerations; and FCOG rework issues.\",\"PeriodicalId\":332554,\"journal\":{\"name\":\"15th DASC. AIAA/IEEE Digital Avionics Systems Conference\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-10-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"15th DASC. AIAA/IEEE Digital Avionics Systems Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/DASC.1996.559166\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"15th DASC. AIAA/IEEE Digital Avionics Systems Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DASC.1996.559166","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Display driver interconnect technology for military and avionic AMLCD
The two most important display driver interconnect technology candidates for military and avionic AMLCD are tape automated bonding (TAB), and flip chip on glass (FCOG). These two technologies will be reviewed and compared in detail. The topics presented include: maturity of the respective technologies; infrastructure differences; known good die issues; FCOG layout issues; processing and run rate issues; reliability considerations; and FCOG rework issues.