M. Kanamura, T. Ohki, T. Kikkawa, K. Imanishi, K. Watanabe, K. Joshin
{"title":"用于高频和高功率应用的GaN HEMT的最新进展","authors":"M. Kanamura, T. Ohki, T. Kikkawa, K. Imanishi, K. Watanabe, K. Joshin","doi":"10.1109/RFIT.2012.6401645","DOIUrl":null,"url":null,"abstract":"In this paper, we describe the recent progress in GaN HEMT technology for high-frequency and high-power applications. First, we present the GaN HEMT technology for base-station applications. Then, we discuss the current drift phenomena during RF operation. We also present the device technology for normally off GaN HEMTs.","PeriodicalId":187550,"journal":{"name":"2012 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT)","volume":"114 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Recent progress in GaN HEMT for high-frequency and high-power applications\",\"authors\":\"M. Kanamura, T. Ohki, T. Kikkawa, K. Imanishi, K. Watanabe, K. Joshin\",\"doi\":\"10.1109/RFIT.2012.6401645\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, we describe the recent progress in GaN HEMT technology for high-frequency and high-power applications. First, we present the GaN HEMT technology for base-station applications. Then, we discuss the current drift phenomena during RF operation. We also present the device technology for normally off GaN HEMTs.\",\"PeriodicalId\":187550,\"journal\":{\"name\":\"2012 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT)\",\"volume\":\"114 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/RFIT.2012.6401645\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RFIT.2012.6401645","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Recent progress in GaN HEMT for high-frequency and high-power applications
In this paper, we describe the recent progress in GaN HEMT technology for high-frequency and high-power applications. First, we present the GaN HEMT technology for base-station applications. Then, we discuss the current drift phenomena during RF operation. We also present the device technology for normally off GaN HEMTs.