{"title":"风冷的局限性:现状与挑战","authors":"P. Rodgers, V. Eveloy, Michael Pecht","doi":"10.1109/STHERM.2005.1412167","DOIUrl":null,"url":null,"abstract":"Despite the perception that the limits of air-cooling have been reached, this paper reviews approaches that could maintain the effectiveness of this technology. Key thermal management areas that need to be addressed are discussed including heat sink design and analysis, interface thermal resistance minimization, heat spreading, fan performance, hybrid thermal management, heat sink surface fouling, and sustainability.","PeriodicalId":256936,"journal":{"name":"Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.","volume":"23 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"37","resultStr":"{\"title\":\"Limits of air-cooling: status and challenges\",\"authors\":\"P. Rodgers, V. Eveloy, Michael Pecht\",\"doi\":\"10.1109/STHERM.2005.1412167\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Despite the perception that the limits of air-cooling have been reached, this paper reviews approaches that could maintain the effectiveness of this technology. Key thermal management areas that need to be addressed are discussed including heat sink design and analysis, interface thermal resistance minimization, heat spreading, fan performance, hybrid thermal management, heat sink surface fouling, and sustainability.\",\"PeriodicalId\":256936,\"journal\":{\"name\":\"Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.\",\"volume\":\"23 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-03-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"37\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/STHERM.2005.1412167\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STHERM.2005.1412167","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Despite the perception that the limits of air-cooling have been reached, this paper reviews approaches that could maintain the effectiveness of this technology. Key thermal management areas that need to be addressed are discussed including heat sink design and analysis, interface thermal resistance minimization, heat spreading, fan performance, hybrid thermal management, heat sink surface fouling, and sustainability.
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