65纳米CMOS逻辑门最小工作电压决定因素的研究

T. Yasufuku, S. Iida, H. Fuketa, K. Hirairi, M. Nomura, M. Takamiya, T. Sakurai
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引用次数: 12

摘要

通过对65nm CMOS逻辑门链的测量,研究了CMOS逻辑门最小工作电压(VDDmin)的决定因素。VDDmin由系统组件(VDDmin(SYS))和随机变量组件(VDDmin(RAND))组成。当逻辑门的逻辑阈值电压等于一半电源电压(VDD)时,VDDmin(SYS)最小。通过调整nMOS/pMOS的栅极宽度来实现各逻辑门的逻辑阈值电压的调谐。通过增加栅极宽度或前向体偏置来减小随机阈值变化,从而使VDDmin(RAND)最小化。此外,还首次测定了VDDmin的温度依赖性。VDDmin的最坏角分析温度应根据逻辑电路的门数而改变。
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Investigation of determinant factors of minimum operating voltage of logic gates in 65-nm CMOS
Determinant factors of the minimum operating voltage (VDDmin) of CMOS logic gates are investigated by measurements of logic-gate chains in 65nm CMOS. VDDmin consists of a systematic component (VDDmin(SYS)) and a random variation component (VDDmin(RAND)). VDDmin(SYS) is minimized, when the logic threshold voltage of logic gates equals to half supply voltage (VDD). The tuning of the logic threshold voltage of each logic gate is achieved by the sizing of the gate width of nMOS/pMOS. VDDmin(RAND) is minimized by reducing the random threshold variation achieved by increasing the gate width or the forward body biasing. In addition, the temperature dependence of VDDmin is measured for the first time. The temperature for the worst corner analysis for VDDmin should be changed depending on the number of gate counts of logic circuits.
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