ATPG用于2D/3D更宽的Kogge-Stone加法器电路

D. Mukhopadhyay, Arindam Chatterjee
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引用次数: 1

摘要

众所周知,3D设计比相应的2D设计更有优势,尽管它的设计复杂性更高。一个关键的优势是减少了测试3D电路所需的测试向量集,因为设计分布在多个平面上,每个平面的尺寸都比原始设计小。当这些层上的所有电视组合在一起时,我们仍然得到一个较小的集合,因为电视的复杂性随着电路的大小呈超线性增长。本文设计了4位、8位、16位、32位和64位二维KSA加法器电路。我们使用两个平面创建了相应的KSA电路的3D版本,并以Scan触发器的形式插入必要的控制点。然后,我们使用TetraMax为这些电路创建ATPG测试向量集,以检测卡滞和转换故障。我们发现,与2D版本相比,3D版本使我们能够有效地使用一组更少的测试向量进行粘合前测试,同时增加了故障覆盖率。这与发表在相关文献中的一些结果是一致的。
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ATPG for 2D/3D wider Kogge-Stone Adder circuit
It is an well established fact that 3D design has a number of benefits over corresponding 2D design, albeit with somewhat more design complexity. One key advantage is the reduced set of Test Vectors needed to test a 3D circuit as the design is spread over multiple planes, each plane having reduced size than the original design. When all the TVs across these layers are combined we still get a smaller set as the TV complexity increases super linearly with the size of the circuit. In this paper we designed 4-, 8-, 16-, 32- and 64-bit 2D KSA adder circuits. We created the 3D version of the corresponding KSA circuits using two planes, inserting necessary control points in the form of Scan flip-flops. We then used TetraMax to create ATPG set of Test Vectors for these circuits to detect stuck at and transition faults. We find that the 3D version enables us to use effectively a much reduced set of Test Vectors for pre-bond testing compared to the 2D counterpart at the same time with increasing fault coverage. This is in confirmation with some of the results published in the literature on this.
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