{"title":"嵌入式缺陷的掠角FIB分层及PVC故障隔离分析","authors":"Y. Shen, Ye Chen, Kok Wah Lee, Jie Zhu, Z. Mo","doi":"10.1109/IPFA.2018.8452503","DOIUrl":null,"url":null,"abstract":"In this work we reported a work flow of de-layering method by using glancing angle FIB milling for IC failure analysis. This method doesn't require cleaving the sample cross-section which increases risk of damaging target structure. Instead, a combination of precise laser ablation and FIB milling is used to create a large viewing window before glancing angle FIB milling. Our results demonstrated that the method can become useful alternative of conventional mechanical and/or chemical polishing and were successfully applied in several case studies for analyzing embedded defect or passive voltage contrast (PVC) fault isolation.","PeriodicalId":382811,"journal":{"name":"2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Glancing Angle FIB De-layering for Embedded Defect and PVC Fault Isolation Analysis\",\"authors\":\"Y. Shen, Ye Chen, Kok Wah Lee, Jie Zhu, Z. Mo\",\"doi\":\"10.1109/IPFA.2018.8452503\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this work we reported a work flow of de-layering method by using glancing angle FIB milling for IC failure analysis. This method doesn't require cleaving the sample cross-section which increases risk of damaging target structure. Instead, a combination of precise laser ablation and FIB milling is used to create a large viewing window before glancing angle FIB milling. Our results demonstrated that the method can become useful alternative of conventional mechanical and/or chemical polishing and were successfully applied in several case studies for analyzing embedded defect or passive voltage contrast (PVC) fault isolation.\",\"PeriodicalId\":382811,\"journal\":{\"name\":\"2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2018.8452503\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2018.8452503","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Glancing Angle FIB De-layering for Embedded Defect and PVC Fault Isolation Analysis
In this work we reported a work flow of de-layering method by using glancing angle FIB milling for IC failure analysis. This method doesn't require cleaving the sample cross-section which increases risk of damaging target structure. Instead, a combination of precise laser ablation and FIB milling is used to create a large viewing window before glancing angle FIB milling. Our results demonstrated that the method can become useful alternative of conventional mechanical and/or chemical polishing and were successfully applied in several case studies for analyzing embedded defect or passive voltage contrast (PVC) fault isolation.