{"title":"75um铝细线提升楔形解决方案悬挂中心铅在DPak","authors":"Jocson Emil Lamco, B. Kahar, W. C. Mun","doi":"10.1109/IEMT.2018.8511750","DOIUrl":null,"url":null,"abstract":"Lifted wedge on lead has been the common defect mode (as in Figure 1) encountered in wire bonding process. There are numerous causes for lifted wedge in which many have more obvious causes and some are more eluded to be identified and resolved. This article elaborates on the root causes of lifted stitch, like characterization of a good clamping design and layout through multiple output responses such as bonder current curve traces, design layout simulation, bending test and the shorter foot wedge tool bond parameter through DOE. This solution proved able to eliminate the lifted wedge problem.","PeriodicalId":292144,"journal":{"name":"2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT)","volume":"2 8","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"75um Al Thin Wire Lifted Wedge Solutions on Hanging Centre Lead in DPak\",\"authors\":\"Jocson Emil Lamco, B. Kahar, W. C. Mun\",\"doi\":\"10.1109/IEMT.2018.8511750\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Lifted wedge on lead has been the common defect mode (as in Figure 1) encountered in wire bonding process. There are numerous causes for lifted wedge in which many have more obvious causes and some are more eluded to be identified and resolved. This article elaborates on the root causes of lifted stitch, like characterization of a good clamping design and layout through multiple output responses such as bonder current curve traces, design layout simulation, bending test and the shorter foot wedge tool bond parameter through DOE. This solution proved able to eliminate the lifted wedge problem.\",\"PeriodicalId\":292144,\"journal\":{\"name\":\"2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT)\",\"volume\":\"2 8\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMT.2018.8511750\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.2018.8511750","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
75um Al Thin Wire Lifted Wedge Solutions on Hanging Centre Lead in DPak
Lifted wedge on lead has been the common defect mode (as in Figure 1) encountered in wire bonding process. There are numerous causes for lifted wedge in which many have more obvious causes and some are more eluded to be identified and resolved. This article elaborates on the root causes of lifted stitch, like characterization of a good clamping design and layout through multiple output responses such as bonder current curve traces, design layout simulation, bending test and the shorter foot wedge tool bond parameter through DOE. This solution proved able to eliminate the lifted wedge problem.
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