Kousuke Nambara, Shoichi Umezu, H. Yotsuyanagi, M. Hashizume, Shyue-Kung Lu
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Threshold value estimation of electrical interconnect tests with scan FFs
An estimation method of a threshold value for electrical interconnect tests is proposed for detecting open defects at interconnects between dies in a 3D IC. Threshold values of a circuit made of our prototyping IC on a printed circuit board are derived by the estimation method. The results show us that resistive open defects whose resistance is larger than 16.1Ω can be detected with a threshold value estimated by the method.