带扫描FFs的电气互连测试阈值估计

Kousuke Nambara, Shoichi Umezu, H. Yotsuyanagi, M. Hashizume, Shyue-Kung Lu
{"title":"带扫描FFs的电气互连测试阈值估计","authors":"Kousuke Nambara, Shoichi Umezu, H. Yotsuyanagi, M. Hashizume, Shyue-Kung Lu","doi":"10.1109/ICSJ.2014.7009634","DOIUrl":null,"url":null,"abstract":"An estimation method of a threshold value for electrical interconnect tests is proposed for detecting open defects at interconnects between dies in a 3D IC. Threshold values of a circuit made of our prototyping IC on a printed circuit board are derived by the estimation method. The results show us that resistive open defects whose resistance is larger than 16.1Ω can be detected with a threshold value estimated by the method.","PeriodicalId":362502,"journal":{"name":"IEEE CPMT Symposium Japan 2014","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Threshold value estimation of electrical interconnect tests with scan FFs\",\"authors\":\"Kousuke Nambara, Shoichi Umezu, H. Yotsuyanagi, M. Hashizume, Shyue-Kung Lu\",\"doi\":\"10.1109/ICSJ.2014.7009634\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"An estimation method of a threshold value for electrical interconnect tests is proposed for detecting open defects at interconnects between dies in a 3D IC. Threshold values of a circuit made of our prototyping IC on a printed circuit board are derived by the estimation method. The results show us that resistive open defects whose resistance is larger than 16.1Ω can be detected with a threshold value estimated by the method.\",\"PeriodicalId\":362502,\"journal\":{\"name\":\"IEEE CPMT Symposium Japan 2014\",\"volume\":\"3 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE CPMT Symposium Japan 2014\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICSJ.2014.7009634\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE CPMT Symposium Japan 2014","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICSJ.2014.7009634","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

提出了一种用于检测三维集成电路中模具间互连处开放缺陷的电气互连测试阈值的估计方法,并通过该估计方法导出了由我们的原型集成电路在印刷电路板上制成的电路的阈值。结果表明,该方法可以用估计的阈值检测出阻值大于16.1Ω的阻性开放缺陷。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Threshold value estimation of electrical interconnect tests with scan FFs
An estimation method of a threshold value for electrical interconnect tests is proposed for detecting open defects at interconnects between dies in a 3D IC. Threshold values of a circuit made of our prototyping IC on a printed circuit board are derived by the estimation method. The results show us that resistive open defects whose resistance is larger than 16.1Ω can be detected with a threshold value estimated by the method.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Low power penalty, dry-film polymer waveguides for silicon photonics chip packaging Miniaturized LTE modem SiP using novel multiple compartments shielding Evaluation of thermal interface material with electric capacitance measurement: A new method using metal meshes to present finer surface roughness levels High speed LCP board for 28Gbps transmission through 300mm Visualization of tissue collagen with femtosecond laser: application to skin diagnosis and cell culture
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1