{"title":"电源模块可靠性评估研究综述","authors":"Shima Khoshzaman, I. Hahn","doi":"10.1109/SPEEDAM.2018.8445368","DOIUrl":null,"url":null,"abstract":"The continuous increase in the requirements of power modules in industrial applications is the motivation to draw more attention towards reliability and the state-of-health assessment of them. The basics of conventional module packaging technology containing base plate, bond wires and solder layers and its limitations are reviewed in this paper. Typical end-of-life package-related failures are discussed. In addition, accelerated aging tests and common lifetime estimation models are reviewed.","PeriodicalId":117883,"journal":{"name":"2018 International Symposium on Power Electronics, Electrical Drives, Automation and Motion (SPEEDAM)","volume":"157 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"A Survey on Reliability Assessment of Power Modules\",\"authors\":\"Shima Khoshzaman, I. Hahn\",\"doi\":\"10.1109/SPEEDAM.2018.8445368\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The continuous increase in the requirements of power modules in industrial applications is the motivation to draw more attention towards reliability and the state-of-health assessment of them. The basics of conventional module packaging technology containing base plate, bond wires and solder layers and its limitations are reviewed in this paper. Typical end-of-life package-related failures are discussed. In addition, accelerated aging tests and common lifetime estimation models are reviewed.\",\"PeriodicalId\":117883,\"journal\":{\"name\":\"2018 International Symposium on Power Electronics, Electrical Drives, Automation and Motion (SPEEDAM)\",\"volume\":\"157 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 International Symposium on Power Electronics, Electrical Drives, Automation and Motion (SPEEDAM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SPEEDAM.2018.8445368\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 International Symposium on Power Electronics, Electrical Drives, Automation and Motion (SPEEDAM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SPEEDAM.2018.8445368","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A Survey on Reliability Assessment of Power Modules
The continuous increase in the requirements of power modules in industrial applications is the motivation to draw more attention towards reliability and the state-of-health assessment of them. The basics of conventional module packaging technology containing base plate, bond wires and solder layers and its limitations are reviewed in this paper. Typical end-of-life package-related failures are discussed. In addition, accelerated aging tests and common lifetime estimation models are reviewed.
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