Y. Horikoshi, T. Hashitani, M. Kutami, K. Yazaki, Y. Ando
{"title":"生物基聚合物LSI封装压纹带的生命周期评价","authors":"Y. Horikoshi, T. Hashitani, M. Kutami, K. Yazaki, Y. Ando","doi":"10.1109/ECODIM.2005.1619183","DOIUrl":null,"url":null,"abstract":"This paper assesses the life-cycle of packaging materials designed to protect large-scale integration devices from shock and static electricity when they are transported from semiconductor factories to printed-circuit-board factories. Carbon dioxide (CO2) emitted during production and incineration was reduced by 11% when embossed plastic tape packaging made from non-renewable sources was replaced by material made from bio-based polymer","PeriodicalId":383623,"journal":{"name":"2005 4th International Symposium on Environmentally Conscious Design and Inverse Manufacturing","volume":"90 5","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Life-cycle Assessment of LSI Packaging Embossed Tape Made from Bio-based Polymer\",\"authors\":\"Y. Horikoshi, T. Hashitani, M. Kutami, K. Yazaki, Y. Ando\",\"doi\":\"10.1109/ECODIM.2005.1619183\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper assesses the life-cycle of packaging materials designed to protect large-scale integration devices from shock and static electricity when they are transported from semiconductor factories to printed-circuit-board factories. Carbon dioxide (CO2) emitted during production and incineration was reduced by 11% when embossed plastic tape packaging made from non-renewable sources was replaced by material made from bio-based polymer\",\"PeriodicalId\":383623,\"journal\":{\"name\":\"2005 4th International Symposium on Environmentally Conscious Design and Inverse Manufacturing\",\"volume\":\"90 5\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-12-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2005 4th International Symposium on Environmentally Conscious Design and Inverse Manufacturing\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECODIM.2005.1619183\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2005 4th International Symposium on Environmentally Conscious Design and Inverse Manufacturing","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECODIM.2005.1619183","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Life-cycle Assessment of LSI Packaging Embossed Tape Made from Bio-based Polymer
This paper assesses the life-cycle of packaging materials designed to protect large-scale integration devices from shock and static electricity when they are transported from semiconductor factories to printed-circuit-board factories. Carbon dioxide (CO2) emitted during production and incineration was reduced by 11% when embossed plastic tape packaging made from non-renewable sources was replaced by material made from bio-based polymer
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
