低温点冷却应用的微泵的设计,测试和优化

P. Foroughi, V. Benetis, M. Ohadi, Yuan Zhao, J. Lawler
{"title":"低温点冷却应用的微泵的设计,测试和优化","authors":"P. Foroughi, V. Benetis, M. Ohadi, Yuan Zhao, J. Lawler","doi":"10.1109/STHERM.2005.1412201","DOIUrl":null,"url":null,"abstract":"The performance of two micropumps with different electrode designs in liquid N/sub 2/ was investigated in this study. One of the experimental challenges was developing a method for measuring the flow rate of the liquid N/sub 2/. By combining a numerical model of the non-isothermal flow of the liquid N/sub 2/ around the loop and the experimental measurements of the temperatures around the flow loop, the liquid N/sub 2/ flow rates could be determined accurately enough to compare the pumping performance of these micropumps. The first tested micropump had an electrode spacing of 20 /spl mu/m and an electrode pair spacing of 80 /spl mu/m, while the second pump had an electrode spacing of 50 /spl mu/m and electrode-pair spacing of 200 /spl mu/m. The results showed that both micropumps pumped sufficient liquid N/sub 2/ to cool a typical superconductive sensor or other low power device. For both pumps, the pumping capacities increased with increasing EHD voltage. The pump with the smaller electrode spacing generated a higher flow rate at a lower applied voltage. This pump generated flow rates as high as 10 mL/min at an applied voltage of 500 V.","PeriodicalId":256936,"journal":{"name":"Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.","volume":"15 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"18","resultStr":"{\"title\":\"Design, testing and optimization of a micropump for cryogenic spot cooling applications\",\"authors\":\"P. Foroughi, V. Benetis, M. Ohadi, Yuan Zhao, J. Lawler\",\"doi\":\"10.1109/STHERM.2005.1412201\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The performance of two micropumps with different electrode designs in liquid N/sub 2/ was investigated in this study. One of the experimental challenges was developing a method for measuring the flow rate of the liquid N/sub 2/. By combining a numerical model of the non-isothermal flow of the liquid N/sub 2/ around the loop and the experimental measurements of the temperatures around the flow loop, the liquid N/sub 2/ flow rates could be determined accurately enough to compare the pumping performance of these micropumps. The first tested micropump had an electrode spacing of 20 /spl mu/m and an electrode pair spacing of 80 /spl mu/m, while the second pump had an electrode spacing of 50 /spl mu/m and electrode-pair spacing of 200 /spl mu/m. The results showed that both micropumps pumped sufficient liquid N/sub 2/ to cool a typical superconductive sensor or other low power device. For both pumps, the pumping capacities increased with increasing EHD voltage. The pump with the smaller electrode spacing generated a higher flow rate at a lower applied voltage. This pump generated flow rates as high as 10 mL/min at an applied voltage of 500 V.\",\"PeriodicalId\":256936,\"journal\":{\"name\":\"Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.\",\"volume\":\"15 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-03-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"18\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/STHERM.2005.1412201\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STHERM.2005.1412201","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 18

摘要

研究了两种不同电极设计的微泵在N/sub /液体中的性能。实验挑战之一是开发一种测量液体N/sub / 2流速的方法。通过结合环内液体N/sub - 2/非等温流动的数值模型和环内温度的实验测量,可以准确地确定液体N/sub - 2/流量,从而比较这些微泵的泵送性能。第一个微泵的电极间距为20 /spl mu/m,电极对间距为80 /spl mu/m,第二个微泵的电极间距为50 /spl mu/m,电极对间距为200 /spl mu/m。结果表明,两种微泵都能泵出足够的液体N/sub 2/来冷却典型的超导传感器或其他低功率器件。两种泵的泵送能力都随着EHD电压的升高而增加。具有较小电极间距的泵在较低的施加电压下产生较高的流量。该泵在500 V的施加电压下产生的流量高达10 mL/min。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Design, testing and optimization of a micropump for cryogenic spot cooling applications
The performance of two micropumps with different electrode designs in liquid N/sub 2/ was investigated in this study. One of the experimental challenges was developing a method for measuring the flow rate of the liquid N/sub 2/. By combining a numerical model of the non-isothermal flow of the liquid N/sub 2/ around the loop and the experimental measurements of the temperatures around the flow loop, the liquid N/sub 2/ flow rates could be determined accurately enough to compare the pumping performance of these micropumps. The first tested micropump had an electrode spacing of 20 /spl mu/m and an electrode pair spacing of 80 /spl mu/m, while the second pump had an electrode spacing of 50 /spl mu/m and electrode-pair spacing of 200 /spl mu/m. The results showed that both micropumps pumped sufficient liquid N/sub 2/ to cool a typical superconductive sensor or other low power device. For both pumps, the pumping capacities increased with increasing EHD voltage. The pump with the smaller electrode spacing generated a higher flow rate at a lower applied voltage. This pump generated flow rates as high as 10 mL/min at an applied voltage of 500 V.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Rudimentary finite element thermal modeling of platelet-filled polymer-ceramic composites Smart chip, system and data center enabled by advanced flexible cooling resources Temperature mapping of metal interconnects using scanning thermoreflectance microscope A practical implementation of silicon microchannel coolers for high power chips Potential thermal security risks
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1