ZnO-NRs和ge芯片带隙消除元素半导体和化合物半导体应用的研究

Mohammad Mohsen Hewadmal, Mujibullah Mahboob, Sayed Abdul Saboor Mosamem
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摘要

本文采用四探针法和紫外-可见光谱法研究了锗(Ge)和氧化锌(ZnO)材料的带隙。在FTO衬底上制备了Ge纳米棒和ZnO纳米棒作为样品。利用扫描电子显微镜和x射线衍射光谱分析了基体上ZnO颗粒的形貌和晶体结构。为了得到Ge的带隙,记录了电压随温度在电流中的变化,并对ZnO-纳米棒(NRs)进行了(200-800)nm范围内的吸收光谱。根据得到的数据和计算,确定了Ge和ZnO-NRs的带隙分别在和附近。结果表明,与单质半导体(Ge)相比,复合半导体(ZnO- NRs)的带隙足够大,从而为工业上各种器件的改造提供了可能。
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The Study of ZnO-NRs and Ge-chips Bandgaps for the Elimination of Elemental Semiconductors and Compound Semiconductors Applications
In this paper, the bandgap of Germanium (Ge) and Zinc-Oxid (ZnO) materials were studied using two different techniques called the four-probe method and UV-Visible spectroscopy. A chip of Ge and a ZnO synthesized Nanorods on the FTO substrate were utilized as the samples. Scanning electron microscopy and X-ray diffraction spectroscopy were applied to understand the morphology and the crystal structure of the ZnO particles on the substrate. To get bandgap for Ge, the variation of voltage concerning temperature in  current was recorded, and for ZnO- Nanorods (NRs), the absorption spectra in the range of (200-800) nm were taken. Based on obtained data and calculations, the band gap of Ge and ZnO-NRs were determined to be around  and  respectively. It revealed that the bandgap of compound semiconductors (ZnO- NRs) could be sufficiently large as compared to the elemental semiconductors (Ge), and through that, the modification of various devices is possible in the industry.
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