{"title":"大I/O LGA和FCBGA组件在热冲击/循环和老化下的可靠性:HASL和ENEPIG PCB光刻的比较","authors":"R. Ghaffarian","doi":"10.1109/ITHERM.2017.7992638","DOIUrl":null,"url":null,"abstract":"This paper presents the reliability of a plastic land grid array (LGA) with 1156 pads, 1.0-mm pitch, and the reliability of a flip-chip ball grid array (FCBGA) with 1924 balls, 1-mm pitch, assembled with tin-lead solder onto printed circuit boards (PCBs). Surface finishes for PCBs were electroless nickel electroless palladium immersion gold (ENEPIG) and tin-lead hot air solder level (HASL). The LGA assemblies were first subjected to 200 thermal cycles (−55°C to 125°C) and then to 324 hours of aging at +125°C. The FCBGA assemblies were subjected to 200 thermal shock cycles (TS) in the range of −65°C to +150°C. Test results presented include daisy-chain resistances, SEM/X-section images, and dye and pry destructive failure analyses for HASL and ENEPIG surface finishes.","PeriodicalId":387542,"journal":{"name":"2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"89 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Reliability of large I/O LGA and FCBGA assemblies under thermal shock/cycles and aging: Comparison of HASL and ENEPIG PCB finish\",\"authors\":\"R. Ghaffarian\",\"doi\":\"10.1109/ITHERM.2017.7992638\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents the reliability of a plastic land grid array (LGA) with 1156 pads, 1.0-mm pitch, and the reliability of a flip-chip ball grid array (FCBGA) with 1924 balls, 1-mm pitch, assembled with tin-lead solder onto printed circuit boards (PCBs). Surface finishes for PCBs were electroless nickel electroless palladium immersion gold (ENEPIG) and tin-lead hot air solder level (HASL). The LGA assemblies were first subjected to 200 thermal cycles (−55°C to 125°C) and then to 324 hours of aging at +125°C. The FCBGA assemblies were subjected to 200 thermal shock cycles (TS) in the range of −65°C to +150°C. Test results presented include daisy-chain resistances, SEM/X-section images, and dye and pry destructive failure analyses for HASL and ENEPIG surface finishes.\",\"PeriodicalId\":387542,\"journal\":{\"name\":\"2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)\",\"volume\":\"89 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ITHERM.2017.7992638\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITHERM.2017.7992638","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Reliability of large I/O LGA and FCBGA assemblies under thermal shock/cycles and aging: Comparison of HASL and ENEPIG PCB finish
This paper presents the reliability of a plastic land grid array (LGA) with 1156 pads, 1.0-mm pitch, and the reliability of a flip-chip ball grid array (FCBGA) with 1924 balls, 1-mm pitch, assembled with tin-lead solder onto printed circuit boards (PCBs). Surface finishes for PCBs were electroless nickel electroless palladium immersion gold (ENEPIG) and tin-lead hot air solder level (HASL). The LGA assemblies were first subjected to 200 thermal cycles (−55°C to 125°C) and then to 324 hours of aging at +125°C. The FCBGA assemblies were subjected to 200 thermal shock cycles (TS) in the range of −65°C to +150°C. Test results presented include daisy-chain resistances, SEM/X-section images, and dye and pry destructive failure analyses for HASL and ENEPIG surface finishes.
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