{"title":"多编程环境下结构垫(SUP)和通过阵列模式识别的自动分类系统","authors":"S. Yusof, Lau Meng Tee","doi":"10.1109/ISQED.2010.5450519","DOIUrl":null,"url":null,"abstract":"In today's IC Design, EDA tools are not limited to IC designer's toys. The application of EDA has expanded into a larger scope including generation and extraction of critical information of a design for yield, quality and reliability analysis.","PeriodicalId":369046,"journal":{"name":"2010 11th International Symposium on Quality Electronic Design (ISQED)","volume":"59 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-03-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Multi-programming environment for structure under pads (SUP) and via arrays pattern recognition automated classification system\",\"authors\":\"S. Yusof, Lau Meng Tee\",\"doi\":\"10.1109/ISQED.2010.5450519\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In today's IC Design, EDA tools are not limited to IC designer's toys. The application of EDA has expanded into a larger scope including generation and extraction of critical information of a design for yield, quality and reliability analysis.\",\"PeriodicalId\":369046,\"journal\":{\"name\":\"2010 11th International Symposium on Quality Electronic Design (ISQED)\",\"volume\":\"59 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-03-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2010 11th International Symposium on Quality Electronic Design (ISQED)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISQED.2010.5450519\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 11th International Symposium on Quality Electronic Design (ISQED)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISQED.2010.5450519","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Multi-programming environment for structure under pads (SUP) and via arrays pattern recognition automated classification system
In today's IC Design, EDA tools are not limited to IC designer's toys. The application of EDA has expanded into a larger scope including generation and extraction of critical information of a design for yield, quality and reliability analysis.