Prevent Auger Analysis Misjudgment on Bond Pad Surface Element Concentration in the SPC Method

In semiconductors, when the F concentration is high, the F atom on the bond pad surface has a higher risk of causing pad corrosion, jeopardizing the bonding process, and causing reliability problems. Therefore, occurrence of F atom on the pad surface should be minimized. In order to ensure the quality, F-concentration pad surface test is important. General F concentration analysis uses the AES analysis method. However, AES is a semi-quantitative instrument, which means that if one sample is analyzed multiple times, a fluctuation in test results can be observed. This fluctuation can lead to misjudgment of data. Due to machine instability and process instability, even tiny fluctuations can interfere with each other. Thus, in order to effectively clarify minor fluctuation problems, correct action is crucial for wafer manufacturing. This article proposes a suitable range to effectively judge the AES data and use the SPC (Statistical Process Control) method to track it.