Tuojian Lyu, Andrej Lashchev, Sandeep Patil, Udayanto Dwi Atmojo, V. Vyatkin
{"title":"机电群及其虚拟调试","authors":"Tuojian Lyu, Andrej Lashchev, Sandeep Patil, Udayanto Dwi Atmojo, V. Vyatkin","doi":"10.1109/ICM54990.2023.10101912","DOIUrl":null,"url":null,"abstract":"This paper presents a swarm-based architecture for the composition of mechatronic systems from smart components complemented by a Virtual Commissioning (VC) environment. The architecture is based on the IEC 61499 standard. The proposed solution enables plug-and-play composition of the system which is ready to operate ”out of the box” right after it was composed without extra programming.","PeriodicalId":416176,"journal":{"name":"2023 IEEE International Conference on Mechatronics (ICM)","volume":"432 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Mechatronic Swarm and its Virtual Commissioning\",\"authors\":\"Tuojian Lyu, Andrej Lashchev, Sandeep Patil, Udayanto Dwi Atmojo, V. Vyatkin\",\"doi\":\"10.1109/ICM54990.2023.10101912\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a swarm-based architecture for the composition of mechatronic systems from smart components complemented by a Virtual Commissioning (VC) environment. The architecture is based on the IEC 61499 standard. The proposed solution enables plug-and-play composition of the system which is ready to operate ”out of the box” right after it was composed without extra programming.\",\"PeriodicalId\":416176,\"journal\":{\"name\":\"2023 IEEE International Conference on Mechatronics (ICM)\",\"volume\":\"432 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-03-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2023 IEEE International Conference on Mechatronics (ICM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICM54990.2023.10101912\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 IEEE International Conference on Mechatronics (ICM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICM54990.2023.10101912","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This paper presents a swarm-based architecture for the composition of mechatronic systems from smart components complemented by a Virtual Commissioning (VC) environment. The architecture is based on the IEC 61499 standard. The proposed solution enables plug-and-play composition of the system which is ready to operate ”out of the box” right after it was composed without extra programming.
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