{"title":"焊点完整性无损检测方法综述","authors":"D. O'Conchuir, J. Mccurdy, V. Casey","doi":"10.1109/NAECON.1991.165925","DOIUrl":null,"url":null,"abstract":"Non-destructive techniques for solder joint inspection are surveyed. Both commercially available systems and methods still under research are described. The techniques are divided into visual, thermal, X-ray, and acoustic inspection. The mode of operation for each method is described and its good and bad points are looked at. It is seen that each method is suited to a particular inspection need, and no one technique fulfils all the requirements for a perfect system.<<ETX>>","PeriodicalId":247766,"journal":{"name":"Proceedings of the IEEE 1991 National Aerospace and Electronics Conference NAECON 1991","volume":" 16","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1991-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"15","resultStr":"{\"title\":\"Survey of non-destructive inspection methods for solder joint integrity\",\"authors\":\"D. O'Conchuir, J. Mccurdy, V. Casey\",\"doi\":\"10.1109/NAECON.1991.165925\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Non-destructive techniques for solder joint inspection are surveyed. Both commercially available systems and methods still under research are described. The techniques are divided into visual, thermal, X-ray, and acoustic inspection. The mode of operation for each method is described and its good and bad points are looked at. It is seen that each method is suited to a particular inspection need, and no one technique fulfils all the requirements for a perfect system.<<ETX>>\",\"PeriodicalId\":247766,\"journal\":{\"name\":\"Proceedings of the IEEE 1991 National Aerospace and Electronics Conference NAECON 1991\",\"volume\":\" 16\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1991-05-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"15\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the IEEE 1991 National Aerospace and Electronics Conference NAECON 1991\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/NAECON.1991.165925\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the IEEE 1991 National Aerospace and Electronics Conference NAECON 1991","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/NAECON.1991.165925","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Survey of non-destructive inspection methods for solder joint integrity
Non-destructive techniques for solder joint inspection are surveyed. Both commercially available systems and methods still under research are described. The techniques are divided into visual, thermal, X-ray, and acoustic inspection. The mode of operation for each method is described and its good and bad points are looked at. It is seen that each method is suited to a particular inspection need, and no one technique fulfils all the requirements for a perfect system.<>
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