射频电路板中由于装配变化而产生的杂散电容和电感的测量

IEEE Princeton Section Sarnoff Symposium Pub Date : 1995-04-28 DOI:10.1109/SARNOF.1995.636712

M. S. Heutmaker, L.M. Fletcher, J. E. Sohn

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引用次数: 1

摘要

采用微带定向耦合器作为测试电路，测量在4.8 GHz频率下由焊剂残留沉积和焊点几何变化引起的杂散电容和电感。杂散电容小于50飞法拉，杂散电感绝对值小于100皮亨利。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Measurement of stray capacitance and inductance due to assembly variations in radio frequency circuit boards

A microstrip directional coupler is used as a test circuit to measure the stray' capacitance and inductance due to solder flux residue deposits and solder joint geometry variations at frequencies up to 4.8 GHz. The stray capacitance is less than 50 femtofarads, and the absolute value of the stray inductance is less than 100 picohenries.

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IEEE Princeton Section Sarnoff Symposium

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