I. Pagès, B. Baird, J. Wang, T. Sicard, J. Dorkel, P. Dupuy, P. Lance, E. Huynh, Y. Chung
{"title":"先进的电源铜技术,用于SMARTMOS/sup TM/应用设计","authors":"I. Pagès, B. Baird, J. Wang, T. Sicard, J. Dorkel, P. Dupuy, P. Lance, E. Huynh, Y. Chung","doi":"10.1109/ISPSD.2000.856791","DOIUrl":null,"url":null,"abstract":"Cost effective automotive applications and the related circuit designs are requiring new SMARTMOS/sup TM/ technology extensions to manage energy capability and metal debiasing in smart power devices. A thick copper metallization scheme, POWER COPPER, has been integrated and characterized in the circuit design of two electronic modules for automotive applications.","PeriodicalId":260241,"journal":{"name":"12th International Symposium on Power Semiconductor Devices & ICs. Proceedings (Cat. No.00CH37094)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-05-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Advanced power copper technology for SMARTMOS/sup TM/ application designs\",\"authors\":\"I. Pagès, B. Baird, J. Wang, T. Sicard, J. Dorkel, P. Dupuy, P. Lance, E. Huynh, Y. Chung\",\"doi\":\"10.1109/ISPSD.2000.856791\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Cost effective automotive applications and the related circuit designs are requiring new SMARTMOS/sup TM/ technology extensions to manage energy capability and metal debiasing in smart power devices. A thick copper metallization scheme, POWER COPPER, has been integrated and characterized in the circuit design of two electronic modules for automotive applications.\",\"PeriodicalId\":260241,\"journal\":{\"name\":\"12th International Symposium on Power Semiconductor Devices & ICs. Proceedings (Cat. No.00CH37094)\",\"volume\":\"9 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-05-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"12th International Symposium on Power Semiconductor Devices & ICs. Proceedings (Cat. No.00CH37094)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISPSD.2000.856791\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"12th International Symposium on Power Semiconductor Devices & ICs. Proceedings (Cat. No.00CH37094)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISPSD.2000.856791","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Advanced power copper technology for SMARTMOS/sup TM/ application designs
Cost effective automotive applications and the related circuit designs are requiring new SMARTMOS/sup TM/ technology extensions to manage energy capability and metal debiasing in smart power devices. A thick copper metallization scheme, POWER COPPER, has been integrated and characterized in the circuit design of two electronic modules for automotive applications.